परत की गिनती: 16 परतें
मोटाई: 0.6 मिमी
Key Words: High Density Interconnector
Feature: Immersion Silver
Surface Mount Technology: Available
Thickness: 1.6mm, ±10%
Thickness Of Copper: 0.5-14oz (18-490um)
Pcb: Single,double,multilayer Pcb,custom Pcb
Thickness Of Copper: 0.5-14oz (18-490um)
Surface Finishing: HASL/OSP/ENIG
Surface Mount Technology: Available
Vip Process: Yes
Surface Treatment: Immersion Gold
Minimum Hole Diameter: 0.10 Mm
Thickness: 1.6mm, ±10%
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Minimum Hole Diameter: 0.10 Mm
Final Foil External: 1.oz
Copper Thickness: 0.5oz-6oz
Key Words: High Density Interconnector
Packing: Vacuum Packing With Carton Box
Size: As Per Gerber
मिन ट्रेस: 3/3 मील
पीसीबी मोटाई: 1.6 मिमी
अंधा और दफन वियास: उपलब्ध
मोटाई: 0.4-3.2 मिमी
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